POWX1388 EN
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3.5 Preparing to solder
WARNING: Always use safety glasses and ensure the work area is well
ventilated to help avoid breathing in dangerous fumes.
The Soldering Iron is typically used to melt and apply solder on various surfaces including
circuit boards.
Before beginning to solder, secure the workpiece so that it does not move and affect your
accuracy.
Prepare a damp sponge nearby to clean the tip when required.
NOTE: It is highly recommended that the soldering tip is wiped clean on a
damp sponge (not included) after use to prolong service life and
performance.
Melt a small amount of solder onto the tip of the iron (1). This process is known as ‘tinning’
and will assist the heat in flowing from the soldering iron’s tip, to the solder joint. It is
important to do this immediately with new soldering tips.
Ensure that the workpiece and soldering tip are clean.
The workpiece can be cleaned with the use of a small file or knife blade. It is recommended
that the user wipe clean the soldering tip with a damp sponge before, during and after
soldering. This will help promote a cleaner and stronger solder joint.
3.6 Soldering
Hold the soldering iron close to the base of the grip (3), and just above the flange (8) like a
pen.
WARNING: Never touch the shaft (2) or tip (1) as temperatures can range
up to 400° C.
Hold the soldering iron with the tip pressed onto the workpiece for a few second to allow it
to heat up.
Slowly feed the solder onto the joint, not the soldering iron, allowing the solder to melt onto
the joint.
Once the solder has been applied to the joint, hold the workpiece still while removing the
solder and soldering iron simultaneously.
NOTE: A good solder joint will appear smooth and shiny. If this is not the
case, you will need to reheat the joint and re-apply the solder.
NOTE: The solder tip is designed for very high lifetime, so do not need to
replace it under normal use.
